IEEE - Institute of Electrical and Electronics Engineers, Inc. - A comparative study on dicing of multiple project wafers

Proceedings. IEEE Computer Society Annual Symposium on VLSI

Author(s): Meng-Chiou Wu ; Rung-Bin Lin
Sponsor(s): IEEE Comput. Soc. Tech. Comm. on VLSI
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Tampa, FL, USA
Conference Date: 11 May 2005
Page(s): 314 - 315
ISBN (Paper): 0-7695-2365-X
DOI: 10.1109/ISVLSI.2005.3
Regular:

This paper carries out a comparative study on the methods of dicing multi-project wafers (MPW). Our dicing method results in using 40% fewer wafers both for low and high volume production.

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