IEEE - Institute of Electrical and Electronics Engineers, Inc. - Global Trend in Electronics Manufacturing

Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design and Packaging and Components Failure Analysis - 2005

Author(s): D. Shangguan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 June 2005
Conference Location: Shanghai, China
Conference Date: 27 June 2005
Page(s): 1 - 3
ISBN (CD): 0-7803-9293-0
ISBN (Paper): 0-7803-9292-2
DOI: 10.1109/HDP.2005.251430
Regular:

The global trend in electronics manufacturing was reviewed in this paper. First, the global landscape for lead-free soldering and environmental compliance was outlined. This was followed by a... View More

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