IEEE - Institute of Electrical and Electronics Engineers, Inc. - High-G drop impact response and failure analysis of a chip packaged printed circuit board

Proceedings of 7th Electronics Packaging Technology Conference

Author(s): S.T. Jenq ; H.S. Sheu ; Chang-Lin Yeh ; Yi-Shao Lai ; Jenq-Dah Wu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Singapore, Singapore
Conference Date: 7 December 2005
Volume: 2
ISBN (Paper): 0-7803-9578-6
DOI: 10.1109/EPTC.2005.1614478
Regular:

This paper is concerned with constructing a high-G drop impact test condition for investigating the impact induced failure phenomenon of the solder ball array located in the chip packaged printed... View More

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