IEEE - Institute of Electrical and Electronics Engineers, Inc. - Investigating effect of unfilled underfills on board level solder joint reliability of area array packages under drop test and thermal cycling test

Proceedings of 7th Electronics Packaging Technology Conference

Author(s): E.S. Ibe ; K.I. Loh ; Jing-en Luan ; Tong Yan Tee
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Singapore, Singapore
Conference Date: 7 December 2005
Volume: 2
ISBN (Paper): 0-7803-9578-6
DOI: 10.1109/EPTC.2005.1614469
Regular:

The work reported here explores the effect of underfill encapsulants on drop test and thermal cycle reliability of area array packages, such as BGAs, CSPs, and WL-CSPs. An unfilled underfill was... View More

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