IEEE - Institute of Electrical and Electronics Engineers, Inc. - Direct metal to metal bonding for microsystems interconnections and integration

Proceedings of 7th Electronics Packaging Technology Conference

Author(s): X.F. Ang ; G.G. Zhang ; B.K. Tan ; J. Wei ; Z. Chen ; C.C. Wong
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Singapore, Singapore
Conference Date: 7 December 2005
Volume: 2
ISBN (Paper): 0-7803-9578-6
DOI: 10.1109/EPTC.2005.1614435
Regular:

In microsystems integration, microsystem devices with different functions are needed to be electrically connected. To meet higher component needs, more functions are configured within each device... View More

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