IEEE - Institute of Electrical and Electronics Engineers, Inc. - Compliance, deformation and thermal fatigue behavior of multi-copper-column interconnects

Proceedings of 7th Electronics Packaging Technology Conference

Author(s): E.B. Liao ; A.A.O. Tay ; S.S.T. Ang ; H.H. Feng ; R. Nagarajan ; V. Kripesh ; R. Kumar ; I. Mahadevan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Singapore, Singapore
Conference Date: 7 December 2005
Volume: 1
ISBN (Paper): 0-7803-9578-6
DOI: 10.1109/EPTC.2005.1614395
Regular:

In this paper, macro- and micro-modeling technique is implemented to correlate the compliance, deformation and thermal fatigue damage of composite interconnect structures that consist of copper... View More

Advertisement