IEEE - Institute of Electrical and Electronics Engineers, Inc. - New three-dimensional integration technology using self-assembly technique

International Electron Devices Meeting 2005

Author(s): T. Fukushima ; Y. Yamada ; H. Kikuchi ; M. Koyanagi
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Washington, DC, USA
Conference Date: 5 December 2005
Page Count: 4
Page(s): 348 - 351
ISBN (Paper): 0-7803-9268-X
DOI: 10.1109/IEDM.2005.1609347
Regular:

To achieve ultimate super chip integration, we have developed a three-dimensional integration technology called super-smart-stack technology using a self-assembly technique. The chip alignment... View More

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