IEEE - Institute of Electrical and Electronics Engineers, Inc. - CMOS and interconnect reliability interconnect, plasma damage, and ESD reliability

International Electron Devices Meeting 2005

Author(s): Seung Kang ; T. Nogami
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Washington, DC, USA
Conference Date: 5 December 2005
Page Count: 1
Page(s): 178
ISBN (Paper): 0-7803-9268-X
DOI: 10.1109/IEDM.2005.1609299
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