IEEE - Institute of Electrical and Electronics Engineers, Inc. - A novel package approach for multichip modules based on anisotropic conductive adhesives

2005 European Microwave Conference

Author(s): J. Heyen ; A.F. Jacob
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Paris, France
Conference Date: 4 October 2005
Volume: 3
Page Count: 4
ISBN (Paper): 2-9600551-2-8
DOI: 10.1109/EUMC.2005.1610235
Regular:

In this paper, anisotropic conductive pastes (ACP) are proposed for different level interconnections of millimeter-wave multichip modules (MCM) and packages. A novel ACP-based approach for... View More

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