IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal analysis of RF-MEMS switches for power handling front-end

2005 European Microwave Conference

Author(s): F. Coccetti ; B. Ducarouge ; E. Scheid ; D. Dubuc ; K. Grenier ; R. Plana
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Paris, France
Conference Date: 4 October 2005
Volume: 3
Page Count: 4
ISBN (Paper): 2-9600551-2-8
DOI: 10.1109/EUMC.2005.1610225
Regular:

An experimental setup for the characterization of electromagnetic induced heat on MEMS devices undertaking high RF power regime (> 5W) is here proposed. The technique is based on infrared (IR)... View More

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