IEEE - Institute of Electrical and Electronics Engineers, Inc. - Generic packaging technologies for T/R-modules

2005 European Microwave Conference

Author(s): K. Axelsson
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Paris, France
Conference Date: 4 October 2005
Volume: 2
Page Count: 4
ISBN (Paper): 2-9600551-2-8
DOI: 10.1109/EUMC.2005.1610048
Regular:

This paper presents some recent evaluations of packaging technologies for T/R modules over a broad frequency range. The report also presents some examples of hardware demonstrators using the... View More

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