IEEE - Institute of Electrical and Electronics Engineers, Inc. - Low loss multi-wafer vertical interconnects for three dimensional integrated circuits

2005 European Microwave Conference

Author(s): R.R. Lahiji ; K.J. Herrick ; S. Mohammadi ; L.P.B. Katehi
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Paris, France
Conference Date: 4 October 2005
Volume: 1
Page Count: 4
ISBN (Paper): 2-9600551-2-8
DOI: 10.1109/EUMC.2005.1608822
Regular:

A low loss multi-wafer vertical interconnect appropriate for a microstrip-based circuit architecture is proposed. This transition has been designed, fabricated and measured on 100 /spl mu/m thick... View More

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