IEEE - Institute of Electrical and Electronics Engineers, Inc. - High performance vertical interconnections for millimeter-wave multichip modules

2005 European Microwave Conference

Author(s): T. Kangasvieri ; M. Komulainen ; H. Jantunen ; J. Vahakangas
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Paris, France
Conference Date: 4 October 2005
Volume: 1
Page Count: 4
ISBN (Paper): 2-9600551-2-8
DOI: 10.1109/EUMC.2005.1608820
Regular:

This paper presents high performance flip-chip and through-substrate via transition designs applicable in millimeter-wave single or multichip module assemblies. Full-wave electromagnetic analysis... View More

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