IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal Analysis of Printed Circuit Board Due to Thermal Stress By Using Thermography and Holography

Proceedings of the IEEE Instrumentation and Measurement Technology Conference

Author(s): T. Netsu ; M. Taniguchi ; H. Ishida ; T. Yanada ; T. Takagi
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Ottawa, Ont., Canada
Conference Date: 16 May 2005
Volume: 3
Page(s): 1,965 - 1,969
ISBN (Paper): 0-7803-8879-8
DOI: 10.1109/IMTC.2005.1604515
Regular:

By using both FEMLAB simulator and the Thermography, the thermal pattern was analyzed of printed circuit board deformed due to thermal stress. And, the deformation pattern was measured by using... View More

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