IEEE - Institute of Electrical and Electronics Engineers, Inc. - Wavelet-Based Enveloping for Spindle Health Diagnosis

Proceedings of the IEEE Instrumentation and Measurement Technology Conference

Author(s): Li Zhang ; R.X. Gao ; K.B. Lee
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Ottawa, Ont., Canada
Conference Date: 16 May 2005
Volume: 2
Page(s): 1,203 - 1,208
ISBN (Paper): 0-7803-8879-8
DOI: 10.1109/IMTC.2005.1604337
Regular:

A new method for identifying structural defect-induced vibration signals was developed based on the analytic wavelet transform. The advantage of this method is that it extracts a defect-related... View More

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