IEEE - Institute of Electrical and Electronics Engineers, Inc. - Out-of-plane electrothermally actuated bistable buckled microbridge actuator

2005 IEEE Sensors

Author(s): A. Michael ; K. Yu ; M. Mackenzie ; C.Y. Kwok
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Irvine, CA, USA
Conference Date: 30 October 2005
ISBN (Paper): 0-7803-9056-3
ISSN (Paper): 1930-0395
DOI: 10.1109/ICSENS.2005.1597769
Regular:

In this paper, we report the design, simulation, and fabrication of a novel electro-thermally actuated buckled micro-bridge for out of plane-actuation. The new structure consists of a beam... View More

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