IEEE - Institute of Electrical and Electronics Engineers, Inc. - Fabrication of multi-layered structure by advanced reversal imprints lithography

Digest of Papers Microprocesses and Nanotechnology 2005. 2005 International Microprocesses and Nanotechnology Conference

Author(s): M. Nishihata ; K. Okuda ; T. Aoyama ; T. Yoshikawa ; Y. Hirai
Sponsor(s): Japan Soc. of Appl. Phys
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Tokyo, Japan, Japan
Conference Date: 25 October 2005
Page(s): 252 - 253
ISBN (Paper): 4-9902472-2-1
DOI: 10.1109/IMNC.2005.203833
Regular:

Advanced reversal imprint process to eliminate the breaking defects at the pattern edge is newly proposed and demonstrate contact window pattern transfer on the lower layer. We believe this... View More

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