IEEE - Institute of Electrical and Electronics Engineers, Inc. - In-situ monitoring of cavity filling in nanoimprint by capacitance

Digest of Papers Microprocesses and Nanotechnology 2005. 2005 International Microprocesses and Nanotechnology Conference

Author(s): C.C. Nien ; H. Hocheng
Sponsor(s): Japan Soc. of Appl. Phys
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Tokyo, Japan, Japan
Conference Date: 25 October 2005
Page(s): 200 - 201
ISBN (Paper): 4-9902472-2-1
DOI: 10.1109/IMNC.2005.203807
Regular:

During nanoimprint, the uniformity and precision of the imprinted nanoscale structure and components are affected when the mold filling becomes irregular. To overcome the shortcomings of the... View More

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