IEEE - Institute of Electrical and Electronics Engineers, Inc. - Wafer level vertical interconnection method for microcolumn array

Digest of Papers Microprocesses and Nanotechnology 2005. 2005 International Microprocesses and Nanotechnology Conference

Author(s): Changho Han ; Hyeon Cheol Kim ; Moon Koo Kang ; Kukjin Chun
Sponsor(s): Japan Soc. of Appl. Phys
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Tokyo, Japan, Japan
Conference Date: 25 October 2005
Page(s): 106 - 107
ISBN (Paper): 4-9902472-2-1
DOI: 10.1109/IMNC.2005.203760
Regular:

A concept of miniaturized and arrayed electron beam system using vertical interconnection was proposed and fabrication with interconnection using metal reflow was performed. The interconnection of... View More

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