IEEE - Institute of Electrical and Electronics Engineers, Inc. - Transient analysis of thermal junctions within a thermoelectric cooling assembly

Fifteenth International Conference on Thermoelectrics. Proceedings ICT '96

Author(s): Nagy, M.J. ; Buist, R.J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1996
Conference Location: Pasadena, CA, USA, USA
Conference Date: 26 March 1996
Page(s): 288 - 292
ISBN (Paper): 0-7803-3221-0
DOI: 10.1109/ICT.1996.553319
Regular:

The performance of a thermoelectric (TE) heat exchanger assembly is greatly affected by the quality of the thermal junctions connecting the modules and the mounting surfaces of the heat/cold... View More

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