IEEE - Institute of Electrical and Electronics Engineers, Inc. - Process management system analysis and design of SMT reflow soldering process

2005 6th International Conference on Electronics Packaging Technology

Author(s): Li Chun-quan ; Wu Zhao-hua
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Shenzhen, China
Conference Date: 30 August 2005
Page(s): 279 - 284
ISBN (Paper): 0-7803-9449-6
DOI: 10.1109/ICEPT.2005.1564743
Regular:

Reflow soldering processes are the key processes affecting SMT product quality. First, in the paper, the essential of building SMT processes management was discussed. Then, based on the... View More

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