IEEE - Institute of Electrical and Electronics Engineers, Inc. - Study on Optimizing Material Parameters in the Acoustic-Vibration Sensors Isolation Packaging System

2005 6th International Conference on Electronics Packaging Technology

Author(s): Yin Jinghua ; Lu Guangjun ; Gong Chunqing ; Liu Xiaowei ; Lei Qingquan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Shenzhen, China
Conference Date: 30 August 2005
Page(s): 1 - 3
ISBN (Paper): 0-7803-9449-6
DOI: 10.1109/ICEPT.2005.1564742
Regular:

The acoustic-vibration sensors system is a kind of MEMS devices, which has a potential application prospect and its packaging plays key part in the fabrication process. The double J-Iike package... View More

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