IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effect of unfilled underfill on drop test and thermal cycle reliability

2005 6th International Conference on Electronics Packaging Technology

Author(s): E.S. Ibe ; K.I. Loh ; Jing-en Luan ; Tong Yan Tee
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Shenzhen, China
Conference Date: 30 August 2005
Page(s): 175 - 179
ISBN (Paper): 0-7803-9449-6
DOI: 10.1109/ICEPT.2005.1564728
Regular:

The work reported here explores the effect of underfill encapsulants on drop test and thermal cycle reliability of area array packages, such as BGA's, CSP's, and WL-CSP's. An unfilled underfill... View More

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