IEEE - Institute of Electrical and Electronics Engineers, Inc. - Analysis of PCB subassembly dynamic responses using integrated analytical, numerical and experimental techniques

2005 6th International Conference on Electronics Packaging Technology

Author(s): Jing-en Luan ; Tong Yan Tee
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Shenzhen, China
Conference Date: 30 August 2005
Page(s): 133 - 140
ISBN (Paper): 0-7803-9449-6
DOI: 10.1109/ICEPT.2005.1564715
Regular:

The mechanical shock causes multiple PCB bending or vibration which induces the solder joint fatigue failure. The solder joint failures are strongly dependent on many factors. In particular, PCB... View More

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