IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effect of Rare Earths on Microstructure and Properties of Sn2.0Ag0.7CuRE Solder Alloy

2005 6th International Conference on Electronics Packaging Technology

Author(s): Zhang Keke ; Cheng Guanghui ; Yu Yangchun ; Yan Yanfu ; Man Hua
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Shenzhen, China
Conference Date: 30 August 2005
Page(s): 1 - 4
ISBN (Paper): 0-7803-9449-6
DOI: 10.1109/ICEPT.2005.1564711
Regular:

In the study the fabrication, microstructure, mechanical and physical properties and wettability of Sn2.0Ag0.7CuRE solder alloy are investigated. Result shows that when the... View More

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