IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thick Film Lithography Techniques utilizing state-of-the-art Proximity Aligners for BEoL Applications

2005 6th International Conference on Electronics Packaging Technology

Author(s): R. Pelzer ; H. Kirchberger
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Shenzhen, China
Conference Date: 30 August 2005
Page(s): 1 - 5
ISBN (Paper): 0-7803-9449-6
DOI: 10.1109/ICEPT.2005.1564705
Regular:

Wafer-level packaging is a promising technology to meet future demands of increased performance for advanced integrated circuits with tighter pitch and higher I/O counts (higher feature density).... View More

Advertisement