IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effects of Testing Conditions and Multiple Reflows on Cold Bump Pull Test of Pb-free Solder Balls

2005 6th International Conference on Electronics Packaging Technology

Author(s): F. Songa ; S.W.R. Lee ; Fubin Song
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Shenzhen, China
Conference Date: 30 August 2005
Page(s): 1 - 7
ISBN (Paper): 0-7803-9449-6
DOI: 10.1109/ICEPT.2005.1564698
Regular:

Ball pull test has emerged to be an attractive alternative to the traditional ball shear testing method for characterizing the attachment strength of solder interconnection. Since this is a... View More

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