IEEE - Institute of Electrical and Electronics Engineers, Inc. - Reliability study of ceramic substrate in a SIP type package

2005 6th International Conference on Electronics Packaging Technology

Author(s): Yumin Liu ; Yong Liu ; J. Yang ; Qiuxiao Qian ; S. Irving
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Shenzhen, China
Conference Date: 30 August 2005
Page(s): 84 - 87
ISBN (Paper): 0-7803-9449-6
DOI: 10.1109/ICEPT.2005.1564693
Regular:

Ceramic substrate reliability in a lead frame based system in package (SIP) is investigated during the assembly process. Ceramic is a brittle material in the temperature range of the assembly... View More

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