IEEE - Institute of Electrical and Electronics Engineers, Inc. - Micromachined Packaging for Ultrasonic Transducers with Particle Restraint Mechanisms

2005 6th International Conference on Electronics Packaging Technology

Author(s): Hsing-Cheng Chang ; Chi-Chih Lai ; Hsien-Hui Tseng ; Yen-Ju Chen
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Shenzhen, China
Conference Date: 30 August 2005
Page(s): 1 - 7
ISBN (Paper): 0-7803-9449-6
DOI: 10.1109/ICEPT.2005.1564684
Regular:

The ultrasonic transducer's micropackaging with particle pollution restraint mechanisms using micromachining process is proposed. The developed packaging with active dustproof mechanisms is very... View More

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