IEEE - Institute of Electrical and Electronics Engineers, Inc. - Characterization of the bending creep behavior for electroplating nickel microbeam

2005 6th International Conference on Electronics Packaging Technology

Author(s): C. Tsou ; C. Hsu ; W. Fang ; T.S. Lai ; H.C. Li
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Shenzhen, China
Conference Date: 30 August 2005
Page(s): 195 - 202
ISBN (Paper): 0-7803-9449-6
DOI: 10.1109/ICEPT.2005.1564667
Regular:

This study aims to investigate the creep behavior of electroplating nickel film using bending micromachined cantilever approach. The bending test including quasi-static, reloading, and... View More

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