IEEE - Institute of Electrical and Electronics Engineers, Inc. - Rapid and Selective Induction Heating for Sensor Packaging

2005 6th International Conference on Electronics Packaging Technology

Author(s): Mingxiang Chen ; Xinjian Yi ; Liulin Yuan ; Zhiyin Gan ; Sheng liu
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Shenzhen, China
Conference Date: 30 August 2005
Page(s): 1 - 4
ISBN (Paper): 0-7803-9449-6
DOI: 10.1109/ICEPT.2005.1564665
Regular:

A novel hermetic packaging for sensors using induction heating was presented in this paper. By choosing suitable frequency of high frequency power supply and optimizing the induction coil, rapid... View More

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