IEEE - Institute of Electrical and Electronics Engineers, Inc. - Analysis of Response of the Micro-Machined Poly-Silicon Cantilever Subjected to Vibration Environment

2005 6th International Conference on Electronics Packaging Technology

Author(s): Xiaoling Xu ; Jieying Tang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Shenzhen, China
Conference Date: 30 August 2005
Page(s): 1 - 5
ISBN (Paper): 0-7803-9449-6
DOI: 10.1109/ICEPT.2005.1564663
Regular:

With the decrease in the dimension the microstructure, the effect of the interaction between the surfaces of the neighboring structures on the dynamic characteristics cannot be ignored. We present... View More

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