IEEE - Institute of Electrical and Electronics Engineers, Inc. - Study of copper free air ball in thermosonic copper ball bonding

2005 6th International Conference on Electronics Packaging Technology

Author(s): Chunjin Hanga ; Chunqing Wang ; Mingda Shi ; Xiaochun Wu ; Honghui Wang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Shenzhen, China
Conference Date: 30 August 2005
Page(s): 414 - 418
ISBN (Paper): 0-7803-9449-6
DOI: 10.1109/ICEPT.2005.1564655
Regular:

In order to meet the new requirements of higher performance and reliabilities for electronic devices, the copper wire ball bonding technology was developed to be an alternative method for the gold... View More

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