IEEE - Institute of Electrical and Electronics Engineers, Inc. - IMC Evolution and Reliability of Lead-free Solder Bump Formed by Induction Self Heat Reflow

2005 6th International Conference on Electronics Packaging Technology

Author(s): Mingyu Li ; Hongbo Xu ; Chunqing Wang ; Han Sur Bang ; Hee Seon Bang
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Shenzhen, China
Conference Date: 30 August 2005
Page(s): 1 - 6
ISBN (Paper): 0-7803-9449-6
DOI: 10.1109/ICEPT.2005.1564651
Regular:

Induction self heat reflow (ISHR) technology, which has the advantages of 3-D selective heating and high heating speed, can solve the problems which can't be controlled in traditional reflow... View More

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