IEEE - Institute of Electrical and Electronics Engineers, Inc. - Prediction of Solder Joint geometry for Optical Fiber attachment Assembly in Direct-Coupling Applications

2005 6th International Conference on Electronics Packaging Technology

Author(s): Zhang Wei ; Wang Chunqing ; Tian Yanhong
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Shenzhen, China
Conference Date: 30 August 2005
Page(s): 1 - 3
ISBN (Paper): 0-7803-9449-6
DOI: 10.1109/ICEPT.2005.1564649
Regular:

Fiber attachment soldering is low cost and high-precision technology in direct-coupling optoelectronic packaging. The three-dimensional shape of solder joint in fiber attachment soldering was... View More

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