IEEE - Institute of Electrical and Electronics Engineers, Inc. - Introduction of JIS related to lead-free solder and soldering

2005 6th International Conference on Electronics Packaging Technology

Author(s): T. Takemoto
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Shenzhen, China
Conference Date: 30 August 2005
Page(s): 8 - 12
ISBN (Paper): 0-7803-9449-6
DOI: 10.1109/ICEPT.2005.1564644
Regular:

Toward July 1, 2006, almost all major electric and electronic manufacturing companies have been finished their development on lead-free soldering in Japan. To support the promotion of practical... View More

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