IEEE - Institute of Electrical and Electronics Engineers, Inc. - Delamination prediction in stacked back-end structure underneath bond pads

2005 6th International Conference on Electronics Packaging Technology

Author(s): B.A.E. Van Hal ; G.Q. Zhang ; M.A.J. Van Gils ; R.H.J. Peerlings
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Shenzhen, China
Conference Date: 30 August 2005
Page(s): 1 - 6
ISBN (Paper): 0-7803-9449-6
DOI: 10.1109/ICEPT.2005.1564639
Regular:

The thermo-mechanical reliability of integrated circuits (ICs) gains importance due to the reducing feature sizes and the application of new materials. This paper focuses on the delamination in... View More

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