IEEE - Institute of Electrical and Electronics Engineers, Inc. - Strength Reliability for Surfaces micro-machined Polycrystalline silicon Micro-Cantilevers

2005 6th International Conference on Electronics Packaging Technology

Author(s): Jiang Li-li ; Tang Jie-ying
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Shenzhen, China
Conference Date: 30 August 2005
Page(s): 1 - 4
ISBN (Paper): 0-7803-9449-6
DOI: 10.1109/ICEPT.2005.1564631
Regular:

MEMS components failure often happens where environment effects, such as shock, vibration, and temperature cycles. In this paper, the reliability of surfaces micro-machined polycrystalline silicon... View More

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