IEEE - Institute of Electrical and Electronics Engineers, Inc. - Surface current modelling of the skin effect

Electrical Performance of Electronic Packaging

Author(s): D. De Zutter ; H. Rogier ; L. Knockaert
Sponsor(s): IEEE Microwave Theory and Techniques Soc.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Austin, TX, USA, USA
Conference Date: 24 October 2005
Page Count: 4
Page(s): 363 - 366
ISBN (Paper): 0-7803-9220-5
DOI: 10.1109/EPEP.2005.1563781
Regular:

In this contribution, the skin effect for 2D on-chip interconnections is predicted using a new equivalent surface current concept. First, the features of the new approach are briefly outlined and... View More

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