IEEE - Institute of Electrical and Electronics Engineers, Inc. - CMOS ICs power-supply related decoupling properties

Electrical Performance of Electronic Packaging

Author(s): O. Vikinski ; A. Waizman
Sponsor(s): IEEE Microwave Theory and Techniques Soc.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Austin, TX, USA, USA
Conference Date: 24 October 2005
Page Count: 4
Page(s): 311 - 314
ISBN (Paper): 0-7803-9220-5
DOI: 10.1109/EPEP.2005.1563767
Regular:

On-die decoupling plays important role in CMOS integrated circuits power delivery. A consistent extraction and modeling methodology of on-die inherent and intentional decoupling elements is... View More

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