IEEE - Institute of Electrical and Electronics Engineers, Inc. - A finite-volume method for on-package IR drop characterization

Electrical Performance of Electronic Packaging

Author(s): Xin Wu ; Chetan Desai
Sponsor(s): IEEE Microwave Theory and Techniques Soc.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Austin, TX, USA, USA
Conference Date: 24 October 2005
Page Count: 4
Page(s): 187 - 190
ISBN (Paper): 0-7803-9220-5
DOI: 10.1109/EPEP.2005.1563733
Regular:

A control-volume numerical method is developed for package IR drop analysis. By meshing conductors and solving the governing equations using a finite-volume method with multigrid linear solver,... View More

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