IEEE - Institute of Electrical and Electronics Engineers, Inc. - Towards a traveling wave power distribution module using micromachined packaging techniques for millimeter and submillimeter wave applications

Electrical Performance of Electronic Packaging

Author(s): E.J. Dickman ; J.P. Becker
Sponsor(s): IEEE Microwave Theory and Techniques Soc.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Austin, TX, USA, USA
Conference Date: 24 October 2005
Page Count: 4
Page(s): 139 - 142
ISBN (Paper): 0-7803-9220-5
DOI: 10.1109/EPEP.2005.1563721
Regular:

The design of a waveguide-based power distribution module is presented. Traveling-wave in nature and readily realizable using existing micromachining processes, the structure is a promising... View More

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