IEEE - Institute of Electrical and Electronics Engineers, Inc. - Application of transmission line models to backpanel plated through-hole via design

Electrical Performance of Electronic Packaging

Author(s): Shaowei Deng ; T.H. Hubing ; J.L. Drewniak ; Jun Fan ; J.L. Knighten ; N.W. Smith
Sponsor(s): IEEE Microwave Theory and Techniques Soc.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Austin, TX, USA, USA
Conference Date: 24 October 2005
Page Count: 4
Page(s): 99 - 102
ISBN (Paper): 0-7803-9220-5
DOI: 10.1109/EPEP.2005.1563711
Regular:

This paper introduces an approach of using a plated through-hole (PTH) via transmission-line model in the design of a thick printed circuit board, such as a backpanel. Full wave FEM modeling of a... View More

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