IEEE - Institute of Electrical and Electronics Engineers, Inc. - Coupled Simulation of Device Performance and Heating of Vertically Stacked Three-Dimensional Integrated Circuits

2005 International Conference On Simulation of Semiconductor Processes and Devices

Author(s): A. Akturk ; N. Goldsman ; G. Metze
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2005
Conference Location: Tokyo, Japan, Japan
Conference Date: 1 September 2005
Page(s): 115 - 118
ISBN (Paper): 4-9902762-0-5
DOI: 10.1109/SISPAD.2005.201486
Regular:

We have developed a method for calculating the temperature distribution of a three-dimensional (3D) integrated circuit (IC) and the performance of a single device self-consistently. At the device... View More

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