IEEE - Institute of Electrical and Electronics Engineers, Inc. - Temperature profiles for MCM-D flip chip assemblies at cryogenic conditions

Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings

Author(s): Ulrich, R. ; Rajan, S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1996
Conference Location: Austin, TX, USA
Conference Date: 5 March 1996
Page(s): 30 - 35
ISBN (Paper): 0-7803-3139-7
ISSN (Paper): 1065-2221
DOI: 10.1109/STHERM.1996.545088
Regular:

A high-power flip chip thermal test vehicle was fabricated and powered up in liquid nitrogen under saturated pool boiling conditions and in an unsaturated cryo chamber held at 90 K. The test... View More

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