IEEE - Institute of Electrical and Electronics Engineers, Inc. - DATE panel chips of the future: soft, crunchy or hard?

Proceedings. Design, Automation and Test in Europe Conference and Exhibition

Author(s): P.G. Paulin
Sponsor(s): EDAA, EDA Consortium, IEEE Comput. Soc. TTTC
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2004
Conference Location: Paris, France, France
Conference Date: 16 February 2004
Volume: 2
Page Count: 6
ISBN (Paper): 0-7695-2085-5
ISSN (Paper): 1530-1591
DOI: 10.1109/DATE.2004.1268990
Regular:

Today's electronic products are composed of an increasingly diverse set of ICs, ranging from dedicated ASICs, domain-specific ASSPs, platform FPGAs, to general-purpose FPGA's. With increasing... View More

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