IEEE - Institute of Electrical and Electronics Engineers, Inc. - Reactive disassembly planning using Internet

SICE 2003 Annual Conference

Author(s): T. Murayama ; K. Kagawa ; F. Oba
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2003
Conference Location: Fukui, Japan, Japan
Conference Date: 4 August 2003
Volume: 1
Page Count: 6
ISBN (Paper): 0-7803-8352-4
Regular:

This paper proposes a disassembly planning system for recycling or reuse. This system first obtains the data on a used product from a manufacturer through Internet. Using the data, the system... View More

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