IEEE - Institute of Electrical and Electronics Engineers, Inc. - Perspectives and challenges in III-V devices and system-level integration for future wireless applications

2003 IEEE Topical Conference on Wireless Communication Technology

Author(s): J. Schutt-Aine ; M. Feng
Sponsor(s): Inst. of Elec. Eng., Japan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2003
Conference Location: Honolulu, HI, USA, USA
Conference Date: 15 October 2003
Page Count: 3
Page(s): 94 - 96
ISBN (Paper): 0-7803-8196-3
DOI: 10.1109/WCT.2003.1321443
Regular:

The performance of radio frequency (RF) integrated circuits will strongly influence the versatility and portability of future wireless communication systems. Next-generation wireless technologies... View More

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