IEEE - Institute of Electrical and Electronics Engineers, Inc. - The integration of proton bombardment process into the manufacturing of mixed-signal/RF chips

IEEE International Electron Devices Meeting 2003

Author(s): D.D. Tang ; W.C. Lin ; L.S. Lai ; C.H. Wang ; L.P. Lee ; H.M. Hsu ; C.M. Wu ; C.W. Chang ; W.Y. Lien ; C.P. Chao ; C.Y. Lee ; G.J. Chern ; J.C. Guo ; C.S. Chang ; Y.C. Sun ; D.S. Du ; K.C. Lan ; L.F. Lin
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2003
Conference Location: Washington, DC, USA, USA
Conference Date: 8 December 2003
Page Count: 4
ISBN (Paper): 0-7803-7872-5
DOI: 10.1109/IEDM.2003.1269370
Regular:

Proton bombardment technology is integrated into the standard IC process as a post-backend process module to form local semi-insulating regions on mixed-signal/RF chips. With 10/sup 15/ cm/sup... View More

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