IEEE - Institute of Electrical and Electronics Engineers, Inc. - mTest-a new approach to measure material properties from microscopic specimens

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings

Author(s): D. Vogel ; A. Gollhardt ; H. Walter ; R. Dudek ; R. Kuhnert ; B. Michel
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 2001
Conference Location: Potsdam, Germany, Germany
Conference Date: 21 October 2001
Page Count: 9
Page(s): 366 - 374
ISBN (Paper): 0-7803-7220-4
DOI: 10.1109/POLYTR.2001.973310
Regular:

Thermo-mechanical reliability analysis for advanced electronic packaging requires additional material testing approaches. A new approach based on image correlation algorithms has been tested and... View More

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